A DigiTimes report revealed that Sony is the second smartphone vendor to adopt liquid heat-pipe cooling technology for its products, namely the Xperia Z2. The first company to move on from the mainstream graphite carbon fiber solution used for heat dissipation was Japan's NEC, with its MediaS X06E Snapdragon 600-powered smartphone. Around that time, Samsung and Lenovo were also looking up the technology together with Taiwan-based thermal module makers. While specialized heat pipes for smartphones are already available for mass production, the two technological giants decided against adopting them ...
via PhoneArena - News http://ift.tt/1kJIvg2
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